This document describes the features and characteristics of the R Series 741, 742, 743, 744, 745, 746 Technical Thick Film Chip Resistor Arrays, including high density packaging, leadless surface mount construction, low cost, solder coated nickel barrier pads, convex or concave termination options, etc.
This document provides technical data for the CTS Corporation Series 741, 742, 743, 744, 745, and 746 Thick Film Chip Resistor Arrays. These leadless surface mount components feature high density packaging with isolated or bussed circuits, designed to reduce space compared to discrete chip resistors.
| Power Rating (Series 743) | 100W Per Resistor |
|---|---|
| Packaging Type | Tape & reel packaging |
The arrays offer Convex or Concave Termination Options.
The standard operating temperature range extends from -55°C to +125°C.
The parts resist solder heat for 10 seconds at 260°C.