This document is the design support document for ROHM's UQFNxxxV6060/7070/8080/0100 series. It mainly introduces the package dimensions, pin definitions and other information of this series of products.
This document provides technical information for the ROHM UQFNxxxV6060/7070/8080/0100 series semiconductor packages. It covers structure and materials, tape and reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering profiles.
Additional sections describe package dimensions, reel specifications, shipping style, and safety notices. The information is intended for designers and manufacturers who need to integrate these components into electronic assemblies.
| Storage temperature range | 5 to 30°C |
|---|---|
| Storage humidity range | 40 to 70% RH |
| Specified storage period | 1 year |
| Maximum preheating temperature (reflow) | 260°C |
| Preheating zone time | 120 sec max |
| Soldering temperature range | 220°C to 230°C |
| Soldering zone time | 60 sec max |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Cover tape peelback speed | 165° to 180°/mm·min |
The recommended storage temperature is 5 °C to 30 °C.
The preheating temperature should not exceed 260 °C.
The specified storage period is 1 year.
The soldering temperature should be between 220 °C and 230 °C.