This design support document introduces the package dimensions and design considerations for ROHM's UQFNxxSV Dry Pack series
This document provides design engineers with detailed information on the UQFNxxSV series semiconductor packages from ROHM. It includes package structure, material composition, tape‑and‑reel packaging specifications, storage guidelines, marking conventions, footprint dimensions, and recommended soldering profiles.
Key sections cover the physical layout of the package, recommended storage temperature (5‑30 °C) and humidity (40‑70 % RH), maximum storage period of one year, and reflow soldering parameters such as a 260 °C peak temperature and pre‑heat range of 130‑190 °C. The guide also notes that wave soldering is not supported and provides packing and shipping dimensions.
| Storage temperature range | 5–30 °C |
|---|---|
| Storage humidity range | 40–70 % RH |
| Maximum storage period | 1 year |
| Maximum reflow peak temperature | 260 °C |
| Preheating temperature range | 130–190 °C |
No, the wave soldering method is not supported.