lnfineon HYB18T1G400AF HYB18T1G800AF HYB18T1G160AF 1 Gbit DDR2 SDRAM

This is a data sheet about HYB18T1G400AF,HYB18T1G800AF,HYB18T1G160AF 1 Gbit DDR2 SDRAM


lnfineon HYB18T1G400AF HYB18T1G800AF HYB18T1G160AF 1 Gbit DDR2 SDRAM  - cover page
Brand
Infineon
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
89
File format
PDF
File size
1.2 MB
Published
04 June, 2012
Updated
01 October, 2023
MD5 checksum
A16E9C63B7730A7A4EB24795B2F82D1F

About this manual

The HYB18T1G400/800/160AF series are 1 Gb DDR2 SDRAM devices offered by Infineon Technologies. They support data rates up to 667 Mb/s per pin, operate from a 1.8 V ±0.1 V supply, and are available in lead‑free FBGA packages (68‑pin for x4/x8, 92‑pin for x16).

The datasheet provides detailed information on device organization, timing parameters, power consumption, package pinouts, and functional features such as DLL‑enabled operation, On‑Die Termination, and programmable latency.

What's inside

  • Description
  • Ordering Information
  • Pin Description
  • DDR2 Addressing
  • Package Pinouts
  • Functional Description
  • Operating Conditions
  • Timing Specifications
  • Package Dimensions
  • Component Nomenclature

Specifications

Maximum Clock Frequency333 MHz
Data Rate400 – 667 Mb/s per pin
CAS Latency (CL)3 – 5
Supply Voltage1.8 V ±0.1 V
Package (x4/x8)68‑pin FBGA
Package (x16)92‑pin FBGA
Page Size (x4/x8)1 KB
Page Size (x16)2 KB

Frequently asked questions

What is the operating voltage of the HYB18T1G400/800/160AF SDRAM?

The devices operate from a 1.8 V ±0.1 V power supply.

What are the available package types for this DDR2 SDRAM?

68‑pin FBGA packages are used for x4 and x8 parts, while 92‑pin FBGA packages are used for x16 parts.

What is the maximum data rate supported?

Up to 667 Mb/s per pin can be achieved.

What CAS latency options are available?

CAS latency values of 3, 4, or 5 cycles are supported.

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