WLGA04IW02 product design support document, including appearance dimensions, pin definition, package structure and other information.
This design support document from ROHM details the WLGAO4IW02 semiconductor package. It covers the package structure, material composition, tape‑and‑reel packaging, storage conditions, marking information, footprint dimensions, and recommended soldering profiles.
Key sections include the recommended storage temperature (5~30 °C) and humidity (40~70 % RH), a one‑year storage period, peelback strength of the cover tape (0.2‑0.7 N), and detailed tape and reel dimensions. The document also specifies the reflow soldering temperature profile, with a maximum preheat temperature of 260 °C and a soldering range of 220‑230 °C.
| Top view package dimension (mm) | 2.0 ± 0.1 |
|---|---|
| Bottom view package dimension (mm) | 0.325 ± 0.1 × 1.35 |
| Recommended storage temperature | 5~30 °C |
| Recommended storage humidity | 40~70 % RH |
| Specified storage period | 1 year |
| Maximum preheat temperature (reflow) | 260 °C |
| Soldering temperature range (reflow) | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Tape width (mm) | 2.20 |
| Reel dimensions (mm) – A, B, C, D | A 180, B 60, C 13.0, D 20.2 |
The cover tape has a peelback strength ranging from 0.2 N to 0.7 N.