This document describes the dimensions and package dimensions of the VBGAxxxW series products produced by ROHM.
The Design Support Document describes the VBGAxxxW series semiconductor package, covering its structure, materials, and packaging formats such as tape and reel. It includes detailed dimensions, marking conventions, and recommended handling procedures.
Key technical information includes storage temperature and humidity limits, recommended pre‑heat and reflow temperatures, solder ball composition, and peel‑back strength of cover tape. The document also outlines soldering conditions, notes that wave soldering is not supported, and provides typical reel quantities for each package variant.
| Package type | VBGAxxxW series |
|---|---|
| Storage temperature range | 5 to 30°C |
| Storage humidity range | 40 to 70%RH |
| Maximum storage period before soldering | 1 year |
| Preheating temperature | 130°C~190°C |
| Peak reflow temperature | 260°C MAX |
| Solder ball composition | Sn‑3.0Ag‑0.5Cu |
| Cover tape peel‑back strength | 0.2 to 0.7 N |
| Units per reel (VBGA035W040) | 2500 |
Store the packages at 5 °C to 30 °C with 40 % to 70 % relative humidity, and use them within one year before soldering.
Preheat to 130 °C–190 °C, then raise the package surface to a peak of up to 260 °C, with a maximum reflow time of 120 seconds.
The solder balls are made of a Sn‑3.0Ag‑0.5Cu alloy.
No, the wave soldering method is not supported.