This document is about ROHM MSOP8 package design support document
The ROHM MSOP8 design support document describes the external package of the MSOP8 semiconductor package, including handling notes and recommended conditions for viewing the 3‑D content. It is intended to help designers understand the package dimensions and typical application considerations.
The document also contains legal notices, stating that copying is prohibited without consent and that the products are not intended for radiation‑tolerant or safety‑critical applications. Users are advised to follow safety measures and contact ROHM for special‑purpose usage.
No, copying or reproduction of this document is not permitted without ROHM's consent.
No, the products are not designed to be radiation tolerant.