The document provides information about the dimensions and package of ROHM's VBGA128W070 product.
The ROHM VBGA128W070 Design Support Document provides detailed information for designers, including the package’s internal structure, material composition, and dimensional data.
It also covers packaging methods, storage environment, shelf life, recommended soldering parameters, and lot‑number identification to ensure reliable assembly. This manual is written in Japanese.
| Solder ball composition | Sn‑3.0Ag‑0.5Cu |
|---|---|
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage relative humidity | 40 %RH to 70 %RH |
| Shelf life before assembly | 1 year |
The package should be stored at temperatures between 5 °C and 30 °C.
The solder balls are composed of Sn‑3.0Ag‑0.5Cu.
The guaranteed shelf life is 1 year.