This document provides information about the package dimensions and design support document for ROHM's WLGA010V28 product.
This design support document from ROHM describes the WLGA010V28 semiconductor package, covering its structure, materials, and detailed mechanical specifications. It includes information on tape and reel packaging, storage environment, and marking conventions.
Key sections detail footprint dimensions, recommended storage temperature (5~30 °C) and humidity (40~70 % RH), a one‑year storage period, and soldering guidelines such as a maximum reflow temperature of 260 °C and peel‑back strength of 0.2‑0.7 N.
| Package top view dimension | 2.65 mm ±0.1 mm |
|---|---|
| Package bottom view dimension | 2.8 mm ±0.1 mm |
| Recommended storage temperature | 5 °C – 30 °C |
| Recommended storage humidity | 40 % RH – 70 % RH |
| Maximum reflow soldering temperature | 260 °C (max) |
| Cover tape peel‑back strength | 0.2 N – 0.7 N |
| Maximum number of soldering cycles | 3 times |
The package should be stored at 5 °C to 30 °C with a relative humidity of 40 % to 70 %.
The specified storage period is one year, and if left unused for more than 168 hours after opening, a dry‑process is required before soldering.