This document is a design support document for ROHM's SBGA064W060 product.
This document provides detailed information on the SBGA064W060 package, including its structure, materials, and mechanical dimensions. It describes the tape‑and‑reel packaging, labeling, and shipping styles used for the component.
Additional sections cover recommended storage conditions, storage period, and soldering guidelines such as temperature profiles and peel‑back strength. The document also notes that wave soldering is not supported and provides typical footprint dimensions for PCB design.
| Cover tape peelback strength | 0.2–0.7 N |
|---|---|
| Cover tape peelback speed | 165–180° C 300+10 mm/min |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130–190 °C |
| Soldering temperature range | 220–230 °C |
| Recommended storage temperature | 5–30 °C |
| Recommended storage humidity | 40–70 % RH |
| Specified storage period | 1 year |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity.
The cover tape peelback strength is specified as 0.2 to 0.7 N.
No, the wave soldering method is not supported.
The maximum reflow temperature is 260 °C.