VBGAxxxV series design support document, including package dimensions, pin arrangement and other information
The ROHM VBGAxxxV series design support document provides detailed information on package structure, materials, and recommended handling. It covers tape‑and‑reel packaging, labeling, and shipping specifications for the semiconductor component.
Key sections describe storage conditions, marking lot numbers, footprint dimensions, and recommended soldering profiles. The document also includes test methods, peel‑back strength data, and notes on missing IC tolerances, helping designers ensure reliable assembly and performance.
| Package type | VBGAxxxV series |
|---|---|
| Recommended storage temperature | 5 to 30 °C |
| Recommended storage humidity | 40 to 70 % RH |
| Specified storage period | 1 year |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C – 190 °C |
| Soldering temperature range | 220 °C – 230 °C |
| Maximum re‑flow cycles | 2 times |
The recommended storage temperature is 5 °C to 30 °C and the humidity should be kept between 40 % and 70 % RH.
Preheating should be 130 °C to 190 °C, followed by a soldering peak of 220 °C to 230 °C, with a maximum temperature of 260 °C.
The cover‑tape peelback strength is specified as 0.2 N to 0.7 N.
The document states a maximum of two re‑flow soldering cycles.