Cypress CY7C1381C/CY7C1383C 18-Mb Flow-Through SRAM Datasheet

CY7C1381C/CY7C1383C is a 3.3V synchronous flow-through SRAM designed to interface with high-speed microprocessors with minimum glue logic. It features support for 133-MHz bus operations, 512K x 36 and 1M x 18 common I/O, high-performance access rate, and more.


Cypress CY7C1381C/CY7C1383C 18-Mb Flow-Through SRAM Datasheet - cover page
Brand
Cypress
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
36
File format
PDF
File size
565 KB
Published
01 June, 2012
Updated
28 September, 2023
MD5 checksum
0C414E7312C0354F48FA6EBAA502238B

About this manual

The CY7C1381C (512K × 36) and CY7C1383C (1M × 18) are synchronous flow‑through SRAMs designed for high‑speed microprocessor interfaces. They support bus speeds up to 133 MHz, provide fast clock‑to‑output times (6.5 ns at 133 MHz) and feature selectable burst modes via the MODE pin.

The devices are supplied in JEDEC‑standard 100‑pin TQFP, 119‑ball BGA and 165‑ball fBGA packages and operate from a 3.3 V core supply with either 2.5 V or 3.3 V I/O supplies. Detailed pin definitions, timing tables and package diagrams are included in the document.

What's inside

  • Features
  • Functional Description
  • Pin Configurations
  • Pin Definitions
  • Logic Block Diagram
  • Document History

Specifications

Memory capacity512K × 36 (CY7C1381C) / 1M × 18 (CY7C1383C)
Maximum access time6.5 ns (133 MHz version)
Maximum operating current210 mA (133 MHz version)
Maximum CMOS standby current70 mA
Supported bus speedUp to 133 MHz
Core power supply3.3 V
I/O power supply2.5 V or 3.3 V
Package options100‑pin TQFP, 119‑ball BGA, 165‑ball fBGA

Frequently asked questions

What bus speeds does the CY7C1381C/CY7C1383C support?

They support bus operations up to 133 MHz.

What are the power supply requirements for the devices?

The core runs from a 3.3 V supply, and the I/O pins can be powered at either 2.5 V or 3.3 V.

Which package types are available for the CY7C1381C/CY7C1383C?

They are offered in 100‑pin TQFP, 119‑ball BGA and 165‑ball fBGA packages.

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