This document is about Toshiba semiconductor products' quality and reliability assurance. It introduces the quality and reliability assurance measures Toshiba has made in product design, procurement, production, transportation, after-sales service, etc.
Toshiba outlines a comprehensive quality and reliability assurance system that covers product design, material inspection, manufacturing process control, shipping quality, and after‑service support. The system follows standards such as JIS, EIAJ, and MIL‑STD and includes lot quality assurance, incoming inspection, and periodic reliability testing.
The handling precautions section provides specific guidance for mounting microcontrollers, including recommended soldering methods, temperature profiles, and dry‑pack storage. It emphasizes moisture protection, proper baking procedures, and disposal of unused devices in accordance with local regulations.
| Operating temperature range (Tj) | 0 °C to 85 °C |
|---|---|
| Alternative soldering temperature (flat packages) | 260 °C for up to 10 seconds |
| Pre‑heating temperature for reflow | 150 °C for 60‑120 seconds |
| Maximum storage temperature for dry pack | 30 °C / 90 % RH |
The allowable junction temperature (Tj) for Toshiba microcontrollers is 0 °C to 85 °C.
Store the dry‑pack at 30 °C and 90 % relative humidity, and mount the device within 12 months of opening the seal.