This datasheet provides additional information for the GS816118/32/36D, including a new 165-bump BGA package and an x32 organization
This supplemental datasheet provides additional information for the GS816118/32/36D 18‑Mb synchronous SRAM. It introduces a new 16‑S bump BGA Package D and an extra organization option (x32) available only for the 16‑S BGA version. The document also includes detailed pin descriptions, package dimensions, and ordering data.
The file contains tables of pin functions, package drawings, and ordering part numbers for various speed bins and configurations. Revision history notes describe updates such as added speed bins, temperature range markings, and changes to pin and electrical characteristic tables.
| Package Type | 165‑Bump FPBGA (Package D) |
|---|---|
| Package Size | 13 mm x 15 mm |
| Bump Pitch | 1.0 mm |
Customers should add the character "T" to the end of the part number to specify Tape and Reel delivery.