Philips BGF802-20 CDMA800 Power Module Datasheet

This document is a product specification sheet for the CDMA800 power module. The module features typical CDMA IS95 performance with a supply voltage of 28V, output power of 3W, gain of 30dB, efficiency of 18%, and ACPR of less than -53dBc at 750kHz and less than -69dBc at 1.98MHz with a bandwidth of 30kHz. The module is designed for base station RF power amplifiers in the 869 to 894MHz frequency range and is suitable for CDMA IS95, CDMA2000, and multi-carrier applications.


Philips BGF802-20 CDMA800 Power Module Datasheet - cover page
Brand
Philips
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
12
File format
PDF
File size
96 KB
Published
04 May, 2012
Updated
28 September, 2023
MD5 checksum
3AB02C25EB1E4D0870E96C1591A7A92E

About this manual

The BGF802-20 CDMA800 power module is a 25 W LDMOS amplifier designed for base‑station applications in the 869‑894 MHz range. The datasheet lists key electrical parameters such as a 30 V supply voltage, 100 mW input drive power, up to 30 W load power, and typical gain of 30 dB with 15‑18 % efficiency. Performance charts show power gain, efficiency, ACPR and EVM across load conditions.

Mounting recommendations cover mechanical stress avoidance, heatsink flatness (50 µm concave to 50 µm convex), and the use of thermal compounds with conductivity >0.5 W/mK. Detailed procedures describe bolt torque (final 0.4 Nm), thermal‑compound application, and electrical grounding. The document also includes component lists, inspection guidelines, and legal notices.

What's inside

  • Features
  • Pinning
  • Applications
  • Limiting Values
  • Characteristics
  • Mounting Recommendations
  • Thermal Management
  • Electrical Connections
  • Incoming Inspection
  • Data Sheet Status

Specifications

Input drive power (Pp)100 mW
Load power (PL)30 W
Storage temperature (Tstg)-30 °C to +100 °C
Operating temperature (Tmb)-20 °C to +90 °C
Power gain (Gp)28‑32 dB (typical 30 dB)
Efficiency15‑18 %
ACPR @750 kHz< -53 dBc
Thermal compound conductivity> 0.5 W/mK

Frequently asked questions

What flatness is recommended for the heatsink mounting area?

A flatness between 50 µm concave and 50 µm convex is recommended.

Which thermal compounds meet the recommended conductivity?

Compounds such as WPS II, Comp. Trans., 340, and Trans‑Heat have conductivity > 0.5 W/mK.

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