This document specifies the Spansion memory products offered by both Advanced Micro Devices and Fujitsu. The features and characteristics of these products remain unchanged, and they will be available to customers of both companies. Existing part numbers starting with 'Am' and 'MBM' are still supported for ordering.
The Am41DL32x4G is a 32‑Megabit stacked multi‑chip package (MCP) flash memory with an integrated 4‑Mbit SRAM, operating from a single 3.0 V supply. It offers high‑performance access times as fast as 70 ns, simultaneous read/write operation with zero latency, and low‑power modes including standby current of 200 nA.
Key features include a 73‑ball FBGA package (8 × 11.6 mm), operating temperature range of –40 °C to +85 °C, and robust data protection mechanisms such as Secured Silicon (SecSi) sectors and hardware write‑protect pins. The device complies with JEDEC single‑power‑supply flash standards and provides extensive software support via AMD’s Data Management Software (DMS).
| Memory size (Flash) | 32 Megabit (4 M × 8‑Bit / 2 M × 16‑Bit) |
|---|---|
| Memory size (SRAM) | 4 Mbit (512 K × 8‑Bit / 256 K × 16‑Bit) |
| Supply voltage | 2.7 V to 3.3 V |
| Access time | 70 ns (fast) |
| Active read current (1 MHz) | 2 mA |
| Active read current (5 MHz) | 10 mA |
| Standby current | 200 nA |
| Write cycles per sector | ≥ 1 million |
| Data retention (125 °C) | 20 years |
| Package type | 73‑Ball FBGA, 8 × 11.6 mm |
| Operating temperature range | -40 °C to +85 °C |
It operates from 2.7 V to 3.3 V.
The device can achieve access times as fast as 70 ns.
Each sector is guaranteed for at least one million write cycles.
The memory retains data for 20 years at 125 °C.