This file is about USP-6B Reel product information. It is produced by USP brand and has the model USP-6B Reel. The product has 3000 pcs/reel specifications and R Type and L Type two feed directions.
This one‑page document provides power dissipation information for the Torex USP-6B semiconductor device. The data were measured with the device mounted on a board under defined reference conditions.
The measurement setup includes a 40 × 40 mm FR‑4 board, 50 % copper coverage, 1.6 mm thickness, lead‑free soldering, and natural convection cooling. A table lists ambient temperature versus power dissipation and thermal resistance, with a maximum junction temperature of 125 °C.
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper coverage | 50% of board area |
| Board material | Glass Epoxy (FR-4) |
| Board thickness | 1.6 mm |
| Through‑hole size | 4 x 0.8 mm |
| Maximum junction temperature | 125 °C |
| Power dissipation at 25 °C | 1000 mW |
| Thermal resistance at 25 °C | 100.00 °C/W |
The maximum junction temperature (Tj max) is 125 °C.