This document introduces the power dissipation data of USP-6B. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.
This datasheet presents the power‑dissipation characteristics of the Torex USP‑6B power module. The data are intended as reference values for designers using the module on a standard FR‑4 board.
Measurements were taken with the module mounted on a 40 × 40 mm glass epoxy (FR‑4) board, copper traces covering 50 % of the board area, and natural convection cooling. The board thickness is 1.6 mm, and the soldering process is lead‑free. Power‑dissipation values are listed for ambient temperatures ranging from 25 °C to 125 °C.
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper trace coverage | 50 % of board area |
| Thermal resistance | ≈0.85 ℃/W |
The module was mounted on a 40 × 40 mm FR‑4 board with 50 % copper coverage, using natural convection cooling and lead‑free soldering.
A board measuring 40 mm by 40 mm (1,600 mm²) was used.