This document provides power dissipation data for the USP-6B04, including measurement conditions and the relationship between power dissipation and ambient temperature.
This document presents reference power dissipation data for the Torex USP-6B04 power module. The values are measured under defined board‑mount conditions and should be used as guidance for design.
Measurement conditions include a 40 mm × 40 mm FR‑4 board, 1 mm thickness, natural convection ambient, lead‑free soldering, and each inner metal layer comprising about 50 % of the board. Power dissipation values are listed for ambient temperatures of 25 °C and 85 °C, together with the associated thermal resistance. This manual is written in Chinese.
| Board Dimensions | 40mm×40mm (1600mm² one side) |
|---|---|
| Board Thickness | 1.0 mm |
| Through‑hole Size | 4 × 0.4 mm diameter |
The module is mounted on a 40 mm × 40 mm FR‑4 board (1 mm thick) with natural convection ambient, lead‑free soldering, and each inner metal layer about 50 % of the board.