This document introduces the power and thermal dissipation characteristics of USP-8.
This datasheet provides the power‑dissipation characteristics of the USP‑8 power module measured on a standard evaluation board. Values are given for a range of ambient temperatures, allowing designers to estimate thermal performance in their applications.
The reference measurements were taken with the module mounted on a 40 × 40 mm FR‑4 board, copper traces covering 50 % of the board area, using lead‑free solder, and relying on natural convection for cooling. The board thickness is 1.6 mm and the through‑hole dimensions are 4 × 0.8 mm.
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper coverage | 50% |
| Board material | Glass Epoxy (FR-4) |
| Solder type | Lead (Pb) free |
| Cooling method | Natural convection |