This document provides packaging information and reference pattern layout dimensions for the USP-6B04 product.
This document provides reference power‑dissipation data for the Torex USP‑6B04 device. The data are measured under a defined board‑mount condition and can be used as a reference for thermal design.
The reference condition includes a 40 mm × 40 mm FR‑4 board (1.0 mm thick) with lead‑free solder, natural‑convection ambient, and four 0.4 mm through‑hole vias. Power‑dissipation values are listed for ambient temperatures ranging from 25 °C to 125 °C, showing the corresponding thermal resistance and maximum junction temperature.
| Board dimensions | 40 mm × 40 mm |
|---|---|
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.0 mm |
| Through‑hole via size | 4 × 0.4 mm |