USP-8 Reel Tape Specifications: 3,000 pcs/reel R Type: [Device orientation: Right] Standard feed L Type: [Device orientation: Left] Reverse feed
This document provides power dissipation measurements for the USP-8 when mounted on a 40 × 40 mm FR‑4 board. The reference conditions include natural convection, lead‑free soldering, and copper traces covering 50 % of the board area.
Data are presented for various ambient temperatures, showing corresponding power dissipation values and thermal resistance. The maximum junction temperature for board‑mount operation is specified as 125 °C.
| Maximum Junction Temperature (Tj max) | 125 °C |
|---|---|
| Board Dimensions | 40 × 40 mm |
| Copper Trace Coverage | 50 % of board area |
The power dissipation is 1200 mW at 25 °C ambient.
The maximum junction temperature is 125 °C.