This document describes a fluid measuring device for semiconductor manufacturing processes. The device is suitable for various process gases and is designed to be used under normal operating conditions without the risk of ignition or explosion. It comes in high pressure and low pressure specifications, with maximum flow rates of 200L/min and 100L/min respectively. The device has 1/4 and 3/8 connections, and the operating temperature range is -5°C to 40°C. The storage temperature range is -5°C to 50°C. The gas contact parts are made of corrosion-resistant materials and undergo a special surface treatment for high quality and ultra-clean performance.
The XR67 pressure regulator is designed for semiconductor process use with medium flow rates, offering high reliability through smooth handling and ultra‑clean surface treatments. It can replace the XR64 thanks to identical pipe‑end widths and connection positions.
The manual includes technical specifications such as flow rates, pressure ranges, material construction, and connection options, as well as ordering instructions for optional sensors and fittings. This manual is written in Japanese.
| Maximum flow rate (high pressure) | 200 L/min (inlet 15 MPa, outlet 0.7 MPa) |
|---|---|
| Maximum flow rate (low pressure) | 100 L/min (inlet 1 MPa, outlet 0.7 MPa) |
| Diaphragm material | Co‑Ni alloy |
| Gas‑contact part material | Hastelloy G‑22 alloy |
| Weight | 1.6 kg |
| Body material | SUS316L stainless steel |
The high‑pressure version can deliver up to 200 L/min with an inlet pressure of 15 MPa and an outlet pressure of 0.7 MPa.
The diaphragm is made of a Co‑Ni alloy.
Yes, the XR67 can replace the XR64 because they share the same pipe‑end width and connection positions.