This document describes the specifications of a pressure regulator, including the measured fluid, pressure sensor, maximum flow rate, primary and secondary pressure, interface, material, treatment method, air tightness, weight, and features.
This manual describes the XR65 pressure regulator designed for semiconductor process use. It highlights smooth operation, ultra‑clean processing, and digital pressure display using high‑performance sensors.
The document includes detailed specifications such as maximum flow rate, pressure ranges, material construction, leak tightness, and connection fittings, along with optional sensor and cable configurations. This manual is written in Japanese.
| Maximum flow rate | 500 L/min (normal) |
|---|---|
| Primary pressure | 5 MPa |
| Secondary pressure range | 0.01‑0.3 MPa or 0.02‑0.7 MPa |
| Body material | SUS316L |
| Valve seat material | CTFE, fluororesin or polyimide resin |
| Valve spring material | SUS316 |
| Pressure sensor material | SUS630 (17‑4PH) with SiO2 coating |
| Leak tightness (He vacuum method) | ≤1×10⁻¹ Pa·m·s |
| Particle count limit | No particles ≥0.1 µm detected |
| Weight | Approximately 5 kg |
The XR65 can handle a maximum flow rate of 500 L/min under normal conditions.
It supports a primary pressure up to 5 MPa and a secondary (adjustable) pressure of 0.01‑0.3 MPa or 0.02‑0.7 MPa.
The body is made of SUS316L stainless steel, the valve seat uses CTFE, fluororesin or polyimide resin, the valve spring is SUS316, and the C‑ring is pure nickel.
Leak tightness measured by He vacuum method is ≤1×10⁻¹ Pa·m·s.