This document describes the features and characteristics of ceramic transient voltage suppressors and SMD multilayer transient voltage suppressors produced by EPCOS. These products feature ESD protection, bidirectional protection, specified capacitance tolerance for additional EMI filtering, low insertion loss, low leakage current, and no signal distortion.
This document describes EPCOS' controlled‑capacitance series of multilayer ceramic transient voltage suppressors (MLVs). It outlines the construction, case sizes, and features such as bidirectional ESD protection, low leakage, and RoHS compliance. The manual also lists recommended termination types and solder‑pad layouts for lead‑free assembly.
Technical data include maximum RMS and DC operating voltages, ESD discharge capabilities, surge current limits, capacitance ranges, and temperature ratings. Ordering codes, dimensional drawings, and delivery modes are provided, along with safety and handling instructions for conductive‑adhesive gluing and environmental exposure.
| Maximum RMS operating voltage | 4 … 25 V |
|---|---|
| Maximum DC operating voltage | 5.5 … 31 V |
| Maximum surge current (8/20 µs) | 10 … 150 A |
| Nominal capacitance | 33 … 1200 pF |
| Maximum clamping voltage (8/20 µs) | 17 … 67 V |
| Operating temperature (arrays) | –40 °C to +85 °C |
| Storage temperature (arrays) | –40 °C to +125 °C |
They meet level 4 ESD protection according to ISO 10605 and IEC 61000‑4‑2.
Nickel barrier terminations (AgNiSn) are recommended for lead‑free soldering.
Only multilayer varistors with an AgPd termination are approved for conductive‑adhesive gluing.
Arrays should be stored between –40 °C and +125 °C.