Filtronic LP7512 Solid State Ultra Low Noise PHEMT Datasheet

The Filtronic LP7512 is a solid‑state ultra‑low‑noise PHEMT with detailed performance specifications and handling guidelines.


Filtronic LP7512 Solid State Ultra Low Noise PHEMT Datasheet - cover page
Brand
Filtronic
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
2
File format
PDF
File size
30 KB
Published
28 September, 2026
Updated
28 September, 2026
MD5 checksum
1C7023607CB21F4220314703548B7118

About this manual

The LP7512 is an AlGaAs/InGaAs pseudomorphic high‑electron‑mobility transistor designed for ultra‑low noise and usable gain up to 40 GHz. It is offered in a 70 mil ceramic package (P70) and a low‑cost SOT‑23 plastic package, targeting low‑noise receiver pre‑amplifiers for commercial and military applications.

The datasheet provides key electrical parameters, absolute maximum ratings, recommended operating limits, handling precautions, and assembly instructions, enabling designers to integrate the device safely and reliably into RF front‑ends.

What's inside

  • Features
  • Description and Applications
  • Performance Specifications
  • Absolute Maximum Ratings
  • Recommended Continuous Operating Limits
  • Handling Precautions
  • Assembly Instructions
  • Application Notes and Design Data

Specifications

Typical Noise Figure (NF) at 12 GHz0.6 dB
Typical Associated Gain at 12 GHz12.0 dB
Die size18 × 13 mil (460 × 330 µm)
Maximum Drain‑Source Voltage (VDS)4 V
Maximum Gate‑Source Voltage (VGS)-2 V
Maximum Power Dissipation (PT)460 mW

Frequently asked questions

What is the typical noise figure of the LP7512 at 12 GHz?

The LP7512 has a typical noise figure of 0.6 dB at 12 GHz.

What handling precautions are required for the LP7512 PHEMT chips?

The chips should be stored in a dry nitrogen environment and handled with proper ESD precautions throughout storage, handling, assembly, and testing.

What is the recommended die‑attach method for the LP7512?

Gold/tin eutectic solder under a nitrogen atmosphere is the recommended die‑attach method.

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