This paper presents an innovative technique for designing and manufacturing power electronic modules using high performance cost-effective IGBTs assembled in plastic package. This technique allows optimizing both the power switching devices and the converter, in terms of power handling, reliability and cost. This design is well adapted to mass production required by automotive applications.
This document details an innovative technique for designing and manufacturing power electronic modules specifically for Hybrid Electric Vehicles (HEVs). It addresses the need for high-power, cost-effective, and reliable switches by utilizing punch-through IGBTs assembled in plastic packages with IMS substrates. The proposed design optimizes power handling, reliability, and cost for mass production in automotive applications.
| Breakdown Voltage | 600V |
|---|---|
| Rated Current | 50A |
| Module Current | 400A |
| Module Voltage | 600V |
| Module Size | 150 x 83x 18mm |
| Thermal Resistance (IGBT) | 0.107°C/W |
| Thermal Resistance (Diode) | 0.137°C/W |
They are designed for Hybrid Electric Vehicles (HEVs) to provide high power cost-effective power switches.
The devices are assembled in a Max247 plastic package using IMS substrate technology.
The module uses punch-through IGBTs (PT-IGBTs) with a breakdown voltage of 600V.