PowerSO-10RF is a new type of RF plastic package introduced by STMicroelectronics. It features excellent thermal performance, high power capability, high power density and suitability for all reflow soldering methods.
The document introduces the PowerSO-10RF as STMicroelectronics' first true RF power surface-mount device (SMD) package. It is designed to replace traditional ceramic packages by offering excellent thermal performance in a small outline plastic format suitable for reflow soldering.
The note covers the technology's benefits, including high power density and low parasitic inductance, alongside specific assembly instructions such as vapor phase reflow profiles and pad layouts. It also details reliability testing results and provides mounting recommendations to ensure optimal thermal dissipation.
| Junction temperature | 165° C |
|---|---|
| Maximum power dissipation | 150 W |
The PowerSO-10RF package has a maximum power dissipation capability of 150 W.
The device is designed to operate with a junction temperature of 165° C.