AN2797 SPEAr600 PCB Layout Guidelines Application Note

This document is an application note that provides guidelines for PCB layout design for SPEAr600. SPEAr600 is a member of the SPEAr family of 32-bit embedded MPUs, featuring dual ARM926 cores, an external DDR2 memory interface, and a full set of powerful on-chip peripherals.


AN2797 SPEAr600 PCB Layout Guidelines Application Note - cover page
Brand
STMicroelectronics
Document type
Application Note
Language
English
Pages
23
File format
PDF
File size
449 KB
Published
06 August, 2012
Updated
29 September, 2023
MD5 checksum
6F7CC02245424E6DC4B409916BB3D4FE

About this manual

The document is an application note titled AN2797 designed to guide engineers in creating successful PCB layouts for the SPEAr600 device. The SPEAr600 is a 32-bit embedded MPU featuring dual ARM926 cores running at up to 333 MHz, packaged as a 23 x 23 mm PBGA420 with a 1 mm ball pitch.

The note details specific guidelines for power integrity and the DDR memory interface. It recommends a minimum of 6 PCB layers with closely spaced power/ground plane pairs and specifies low-inductance layouts for decoupling capacitors, such as using 0402 package sizes. Additionally, it covers signal routing requirements for data signals, USB interfaces, and external clock connections to ensure proper operation.

What's inside

  • Power integrity
  • PCB stack up
  • DDR memory interface
  • USB interface
  • GPIO and CLD interface considerations
  • Using an external clock

Frequently asked questions

What is the SPEAr600 device and what are its core specifications?

The SPEAr600 is a 23 x 23 mm PBGA420 device with a 1 mm ball pitch that features dual ARM926 cores running at up to 333 MHz.

What is the minimum number of layers required for the PCB stack up?

A minimum of 6 layers is necessary for the PCB stack up.

What is the recommended trace impedance for DDR signals to minimize reflection?

All traces should have an impedance of 55 Ohm + 10%.

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