This document provides package and usage recommendation information for 500 µm pitch Flip Chips.
This document provides package and usage recommendation information for 500 um pitch Flip Chips. It covers mechanical descriptions, packing specifications, labelling, storage, shipping, and soldering assembly recommendations. The Flip Chip package family is designed to meet the same quality and reliability levels as standard semiconductor plastic packages without requiring special process steps like under fill.
The document details the lead-free bump composition (98.25% Sn, 1.2% Ag, 0.5% Cu, 0.05% Ni) and compatibility with standard lead-free reflow processes. It specifies that devices are delivered in tape and reel packing compatible with existing pick and place equipment. Mechanical dimensions and marking examples are provided, along with specifications for carrier tapes, cover tapes, and seven-inch reels compliant with EIA and IEC standards.
| Pitch | 500 um |
|---|---|
| Bump composition | 98.25% Sn, 1.2% Ag, 0.5% Cu, 0.05% Ni |
| Bump diameter | 310 um |
| Melting point | 218 to 227 °C |
| Package height (uncoated) | 0.65 mm |
| Package height (coated) | 0.695 mm |
| Coplanarity | below 80 um |
| Dice quantity per reel | 5000 |
| Reel type | Seven-inch |
The lead-free bump composition is 98.25% Sn, 1.2% Ag, 0.5% Cu, and 0.05% Ni.
No, this package does not require any extra under fill to increase reliability performances or to protect the device.
Yes, the bump composition is fully compatible with standard lead-free reflow processes.
The bumps have a near eutectic melting point of 218 to 227 °C.