Provides package and usage recommendation information for 400 µm pitch Flip Chips
This document provides package and usage recommendation information for 400 um pitch Flip Chips. It covers mechanical descriptions, packing specifications, labelling, and recommended storage and shipping instructions.
The Flip Chip package family is designed to meet the same quality and reliability levels as standard semiconductor plastic packages. These components are delivered in tape and reel packing compatible with standard high volume SMD components and existing pick and place equipment.
The near eutectic melting point of the bump composition ranges from 218 to 227 °C.
Standard tape width is 8 mm for die sizes smaller than 3 mm.
Each reel is sealed in a transparent, recyclable and antistatic polyethylene bag with a minimum material thickness of 4 mils.