This document describes the features and characteristics of the high-performance IMPACT-X PAL circuits TIBPAL16L8-5C, TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C TIBPAL16L8-7M, TIBPAL16R4-7M, TIBPAL16R6-7M, TIBPAL16R8-7M.
The document describes the TIBPAL16L8 and TIBPAL16R4/6/8 series of High-Performance IMPACT-X PAL circuits. These devices combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic.
The datasheet details electrical characteristics such as maximum frequency (fmax) and propagation delay for both -5C commercial series and -7M military temperature series. It also provides functional block diagrams, logic diagrams showing fuse numbers, pin assignments for various package options (DIP, PLCC, CDIP), and packaging information including orderable device status.
| Max Frequency (no feedback) -5C Series | 125 MHz Min |
|---|---|
| Propagation Delay TIBPAL16L8-5C | 5 ns Max |
| Propagation Delay TIBPAL16R -7M (CLK-to-Q) | 6.5 ns Max |
| Operating Temperature -5C Series | 0°C to 75°C |
| Operating Temperature -7M Series | -55°C to 125°C |
They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses.
The minimum maximum frequency (fmax) for the TIBPAL16R '-5C Series is 125 MHz.
Package options include Plastic and Ceramic Chip Carriers in addition to Plastic and Ceramic DIPs.