The product is an optical endoscope that uses an infrared light source to penetrate the silicon substrate to observe the IC's interconnect lines, wiring status, die bonding conditions, and diffusion zone conditions without damaging the observed part.
The Hamamatsu C2955 is an IC internal inspection system that incorporates an infrared microscope and an infrared CCD camera. It utilizes a newly developed infrared CCD camera to provide high sensitivity and resolution for inspecting pattern images through the silicon substrate of chips from the backside.
Key features include no damage to the part under observation, built-in contrast enhancement, and shading correction functions. The system is best suited for flip-chip evaluation and allows for precise testing of interconnect lines, wire bonding status, die bonding conditions, and diffusion zones without touching metal wiring.
| Imaging device | 2/3-inch infrared CCD |
|---|---|
| Spectral response | 400 nm to 1200 nm |
| Effective photocathode size | 6.3 x 4.7 mm |
| Video monitor resolution | 900 TV lines min. |
| Microscope stage travel area | 153 x 153 mm |
| Light source power | 12 V, 100 W halogen lamp |
It is best suited for flip-chip evaluation and inspecting IC devices from the backside.
No, the system enables observation without damaging the part under observation.