HAMAMATSU C2955 handbook

Update: 30 September, 2023

The product is an optical endoscope that uses an infrared light source to penetrate the silicon substrate to observe the IC's interconnect lines, wiring status, die bonding conditions, and diffusion zone conditions without damaging the observed part.


File format: PDF

Size: -

MD5 Checksum: EA809549269EF272258D5EEC6111DAB9

Publication date: 07 June, 2012

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PDF Link: HAMAMATSU C2955 handbook PDF

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