The document introduces a new 130 kV microfocus X-ray source, L6622-01, and its features and applications. The features include a 10 µm focal spot size, easy handling, continuous operation, and built-in external control function. The applications include X-ray non-destructive testing of printed circuits, electronic components, semiconductor devices, ceramics, soldered parts, rubbers, combinated materials, plastics, new materials, and die casting. Additionally, the product is suitable for multilayer printed circuit board X-ray inspection, industrial on-line process control and measurement, and industrial X-ray computer tomography system.