The document introduces MDM connectors, which are highly reliable, extremely small, and lightweight connectors with higher density contact configurations than traditional rectangular connectors. These connectors are used in applications requiring higher density contact configurations. The connectors employ size 24 MICROPIN/MICROSOCKET contacts on 0.050-inch (1.27mm) centers and feature environmental adaptability, high performance, ruggedness, and moisture-sealed characteristics.
The document describes the ITT MDM connector series, which utilizes size 24 MICROPIN/VMICROSOCKET contacts on .050 (1.27) centers. These connectors are designed as rugged, moisture-sealed microminiature alternatives to traditional rectangular connectors, offering higher density configurations with aluminum shells for EMI/RFI shielding.
| Contact Spacing | .050 (1.27) centers |
|---|---|
| Shell Material | 6061-T6 Aluminum alloy |
| Insulator Materials | Liquid Crystal Polymer, Glass filled diallyl phthalate, Polyphenylene sulfide, Polyester |
| Contact Count Range | 9 thru 100 signal; 5 signal/2 coaxial; 5 signal/2 power, etc. |
| Dielectric Withstanding Voltage | 600 VAC at sea level |
MDM connectors use .050 (1.27) centers.
The shells are made of 6061-T6 Aluminum alloy.
The minimum insulation resistance is 5,000 megohms.