This document provides design support information for VQFN packages, including package dimensions, pad dimensions, and pad pitch.
The document describes the structure, materials and mechanical dimensions of ROHM's VQFN semiconductor packages. It includes detailed tables for footprint dimensions, tape and reel packaging, and recommended soldering profiles.
Additional sections cover recommended storage conditions (temperature 5‑30 °C, humidity 40‑70 % RH, up to 1 year), marking lot numbers, and shipping guidelines. Legal notices and usage limitations are also provided at the end of the file.
| Package type | VQFN |
|---|---|
| Lead frame material | Pb‑free solder plating |
| Die material | Silicon |
| Die attach material | Ag paste |
| Wire material | Au |
| Molding material | Epoxy resin |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Reflow preheat temperature | 130 °C to 190 °C |
| Soldering temperature | 220 °C to 230 °C |
| Units per reel (VQFN16) | 2500 |
Each reel contains 2,500 VQFN16 units.