This is a design support document for an electronic component product, which introduces the package dimensions of the VQFNxxxV6060/7070/8080 series
This document provides technical information for ROHM's VQFNxxxV6060/7070/8080 series semiconductor packages. It describes the package structure, materials, and recommended handling and storage conditions.
Key sections include tape‑and‑reel packaging details, marking lot numbers, footprint dimensions, and recommended soldering temperature profiles. The guide also lists packaging, shipping, and peelback strength specifications for reliable assembly.
| Storage temperature | 5 °C to 30 °C |
|---|---|
| Storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Reflow peak soldering temperature | 220 °C to 230 °C |
| Preheat temperature range | 130 °C to 190 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
| Maximum soldering cycles | 2 times |
| Package length (VQFN048V7070) | 5.00 mm |
The packages should be stored at 5 °C to 30 °C with humidity between 40 % and 70 % RH.
The soldering temperature should not exceed 230 °C.
The package may be soldered a maximum of two times.
The cover tape peelback strength ranges from 0.2 N to 0.7 N.