Motorola MC74HC367A Datasheet

This document is about MC74HC367A technical data sheet. The chip has a 15 LSTTL load drive capability, outputs directly interface to CMOS, NMOS, TTL, operating voltage range is 2 to 6V, input current is 1µA, complies with JEDEC standard 7A requirements, and chip complexity is 92 FETs or 23 equivalent gates.


Motorola MC74HC367A Datasheet - cover page
Brand
Motorola
Category
component datasheet
Document type
Datasheet
Language
English
Pages
6
File format
PDF
File size
157 KB
Published
04 June, 2012
Updated
01 October, 2023
MD5 checksum
A18AFA8D0383F920EA9FBA1A5B6F1634

About this manual

The MC74HC367A is a 3‑state non‑inverting buffer with separate 2‑bit and 4‑bit sections, each having its own active‑low output enable. It is pin‑compatible with the LS367 and compatible with standard CMOS, LSTTL, and TTL outputs.

The document lists maximum ratings, recommended operating conditions, DC and AC electrical characteristics, propagation delays, and detailed outline dimensions for plastic DIP, SOIC, and TSSOP packages. It also includes test circuits, switching waveforms, and mechanical drawing data.

What's inside

  • Technical Data
  • Maximum Ratings
  • Recommended Operating Conditions
  • DC Electrical Characteristics
  • AC Electrical Characteristics
  • Switching Waveforms
  • Test Circuits
  • Outline Dimensions
  • Package Dimensions

Specifications

Operating Voltage Range2 to 6 V
Output Drive Capability15 LSTTL loads
Power Dissipation (Plastic DIP)750 mW
Input Current per Pin20 mA
Output Current per Pin25 mA
Maximum Input Capacitance10 pF
Package OptionsPlastic DIP, SOIC, TSSOP

Frequently asked questions

What is the operating voltage range for the MC74HC367A?

The device operates from 2 V to 6 V.

How much output current can each pin source?

Each output pin can source up to 25 mA.

What is the maximum power dissipation for the DIP package?

The DIP package can dissipate up to 750 mW in still air.

Which package types are available for the MC74HC367A?

The part is offered in Plastic DIP, SOIC, and TSSOP packages.

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