This document is the design support document for ROHM's SBGAxxxT series. This series of packages are 1.2mm high, ultra-thin CSPs, suitable for high-density packaging.
This document provides detailed specifications for the ROHM SBGAxxxT series packages, covering structure, materials, packaging, storage, and soldering guidelines. It includes tables of dimensions, tape and reel configurations, and recommended handling procedures.
The information is intended for designers and manufacturers integrating these BGAs into electronic equipment, offering guidance on footprint dimensions, material composition, and recommended reflow profiles to ensure reliable assembly.
| Interposer material | BT resin |
|---|---|
| Die material | Silicon |
| Wire material | Gold (Au) |
| Solder ball composition | Sn‑3.0Ag‑0.5Cu |
| Cover tape peelback strength | 0.2 – 0.7 N |
| Recommended storage temperature | 5 °C – 30 °C |
| Recommended storage humidity | 40 % – 70 % RH |
| Maximum storage period | 1 year |
| Maximum pre‑heat temperature (reflow) | 260 °C |
| Soldering temperature (reflow) | 220 °C – 230 °C |
The recommended storage temperature is 5 °C to 30 °C.
The solder balls are composed of Sn‑3.0Ag‑0.5Cu.
Cover tape peelback strength is specified as 0.2 N to 0.7 N.