Series 354000 DIP to SOIC Adapters are Aries company's conversion products. They are RoHS/WEEE compliant. The product features convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts.
The Aries 354000 DIP to SOIC adapters offer a convenient, low‑cost way to convert DIP style packaging to SOIC PCB layouts while meeting RoHS and WEEE compliance. Features include a black UL‑94V‑0 glass‑filled nylon body, gold‑plated contacts, and a 3 A current rating.
Technical specifications cover material details, plating thicknesses, insertion/withdrawal forces, and recommended PCB pad dimensions. Ordering information provides part numbers and pin‑count options (8, 14, 16, 20, 24, 28).
| Socket body material | Black UL 94V‑0 glass‑filled 4/6 Nylon |
|---|---|
| PGB thickness | .062 mm (FR406 or 1S410) |
| Male adapter pin material | Brass Alloy 360 1/2 hard (UNS C36000) |
| Female contact pin material | Brass Alloy 360 1/2 hard (UNS C36000) |
| Contact current rating | 3 A |
| Operating temperature | 221 °F (105 °C) |
| Insertion force | 180 g/pin (withdrawal 90 g/pin) |
| Pin count options | 8, 14, 16, 20, 24, 28 |
| Compliance | RoHS, WEEE |
| Ordering code | XX-354000-X1-RC |
The adapter is rated for a contact current of 3 amps.
It can operate up to 221 °F (105 °C).
Insertion force is 180 g per pin and withdrawal force is 90 g per pin.