This data sheet provides specifications for the 350000-11-RC series SOIC DIP adapters.
The Aries 350000-11-RC series provides lead‑free, RoHS/WEEE‑compliant SOIC DIP adapters that can be used without redesigning the PCB layout. They are offered on 0.300 mm (7.62 mil) centers and feature FR406 or IS410 board material, ENIG pad finish, and brass alloy pins with gold and nickel plating.
The leaflet includes mounting recommendations, suggested PCB hole size, and ordering tables for various pin counts. Aries also offers custom materials, platings, sizes, and configurations on request. Contact information and a note on specification changes are provided.
| Board material | 0.062 mm thick FR406 or IS410 per IPC4101A/26 |
|---|---|
| Pad finish | ENIG (Immersion Gold over Electroless Nickel) |
| Pin material | Brass Alloy 360 1/2‑hard per UNS C36000 ASTM‑B16‑00 |
| Pin plating | 10 µin min. gold over 100 µin min. nickel (per MIL‑G‑45204 / SAE‑AMS‑QQ‑N‑290) |
| Operating temperature | 200 °C max |
| Center spacing | 0.300 mm (7.62 mil) centers |
| Recommended PCB hole size | .028 mm + .003 mm (≈ .71 mm + .08 mm) diameter |
The adapters are rated for a maximum operating temperature of 200 °C.
A suggested PCB hole size is .028 mm plus .003 mm (approximately .71 mm + .08 mm) diameter.