OKI PS-800 Soldering System Product Leaflet

Efficient low-power technology is used to collect, analyze, and judge the voltage, current, frequency, and other electrical parameters in the power grid in real time, and remote control and monitoring of the upper computer are realized, so as to realize the remote monitoring, control and protection of the power system.


OKI PS-800 Soldering System Product Leaflet - cover page
Brand
OKI
Category
Industrial Supply
Document type
Product Leaflet
Language
English
Pages
4
File format
PDF
File size
235 KB
Published
09 May, 2012
Updated
30 September, 2023
Model
PS-800
MD5 checksum
49BBA91180E2EB4CD8297CFCA49F8E21

About this manual

The OKI PS-800 Soldering System is a compact production soldering solution that combines SmartHeat® technology with a small‑footprint power supply. It offers replaceable heater tips, an induction coil design and a range of tip geometries for lead‑free hand soldering.

The brochure provides technical specifications, a list of accessories, spare parts and a detailed catalog of heater tips, helping users select the right configuration for their production environment.

What's inside

  • Features
  • Specifications
  • Accessories & Spare Parts
  • Heater Tips
  • Lead‑Free Process Identification

Specifications

Ambient Operating Temperature10 - 40°C
Maximum Enclosure Temperature65°C
Input Line Voltage90 - 240 VAC
Input Line Frequency50/60 Hz
Power Consumption50 Watts max.
Output Power35 Watts max. at 22°C ambient
Output Frequency470 KHz
Power Cord Length183 cm (72")
Dimensions (W x D x H)70 mm x 161 mm x 100 mm

Frequently asked questions

What technology does the PS-800 use that eliminates the need for calibration?

The PS-800 uses SmartHeat® Technology, which requires no calibration.

Why does the PS-800 use replaceable heater tips?

Replaceable heater tips lower the cost of ownership and can be easily removed and replaced.

Is the PS-800 suitable for lead‑free hand soldering?

Yes, the SmartHeat® Technology meets the higher thermal performance requirements of lead‑free alloys without causing thermal damage.

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