OKI Semiconductor MSC23232D/DL-xxBS16/DS16 handbook

MSC23232D/DL-xxBS16/DS16 is a fully decoded, 2,097,152-word x 32-bit CMOS dynamic random access memory module composed of sixteen 4Mb DRAMs in SOJ packages mounted with sixteen decoupling capacitors on a 72-pin glass epoxy single-inline package.


OKI Semiconductor MSC23232D/DL-xxBS16/DS16 handbook - cover page
Brand
OKI
Category
Memory
Document type
Datasheet
Language
English
Pages
9
File format
PDF
File size
53 KB
Published
05 June, 2012
Updated
01 October, 2023
MD5 checksum
A95286768257F5EBEDA38A0FA5853EB0

About this manual

The MSC23232D/DL-xxBS16/DS16 is a fully decoded, 2,097,152-word x 32-bit CMOS dynamic RAM module composed of sixteen 4Mb DRAMs in SOJ packages. It features a 72-pin glass epoxy single-inline package and supports high-density storage applications with a single +5V supply.

What's inside

  • Description
  • Features
  • Product Family
  • Module Outline
  • Pin Configuration
  • Block Diagram
  • Electrical Characteristics
  • DC Characteristics
  • AC Characteristics

Specifications

Organization2,097,152-word x 32-bit
Package Type72-pin Single Inline Memory Module
Supply Voltage+5V + 10% tolerance
Refresh Rate (Standard)1024 cycles/16ms
Refresh Rate (Low Power)1024 cycles/128ms
Operating Temperature0 to +70 °C

Frequently asked questions

What is the difference between the MSC23232D and MSC23232DL versions?

The MSC23232DL is a low-power version specially designed for lower-power applications.

What is the capacity and organization of the MSC23232D/DL module?

The module has a 2,097,152-word x 32-bit organization.

What is the maximum operating temperature for this memory module?

The maximum operating temperature is +70 °C.

How long must a start-up delay be after power-up before operation begins?

A start-up delay of 200us is required after power-up.

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