This document is the datasheet of Freescale Semiconductor MC33661 automotive LIN sub-bus application physical layer component. The component supports 10 kbps and 20 kbps data communication, as well as test and programming modes at a speed of up to 100 kbps. It also features excellent radiated emission performance and safe behavior in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode.
The Local Interconnect Network (LIN) is a serial communication protocol for automotive networks. The Freescale 33661 is a LIN physical layer component that provides selectable slew rates for both low‑speed (10‑20 kbps) and fast‑baud (above 100 kbps) operation, with built‑in protection against bus shorts and leakage.
The datasheet specifies the device’s operating voltage range, ESD robustness, pin functions, and both static and dynamic electrical characteristics, including propagation delays and wake‑up timing. It also includes ordering information, package details (8‑pin SOICN), and revision history.
| Supply Voltage Range | 6.0 V – 18 V (operational), up to 27 V functional |
|---|---|
| Load Dump Voltage | 40 V |
| ESD Rating (LIN Bus Pin) | 5.0 kV |
| Internal Pull‑up Resistor | 30 kΩ |
| Operating Temperature Range | -40 °C – 125 °C |
| Package | 8‑pin SOICN |
The device operates from 6.0 V to 18 V DC and is functional up to 27 V DC.
The LIN bus pin is rated for 5.0 kV ESD protection.
The 33661 is supplied in an 8‑pin SOICN package.