This document introduces Intel® Pentium® III processor low power thermal design guide.
This Application Note supplies thermal performance information for the Intel Pentium III Processor — Low Power, including its power dissipation, junction temperature limits, and the on‑die thermal diode used for temperature monitoring. It outlines the importance of thermal management, defines target thermal parameters, and explains terminology for designers.
The guide details thermal specifications for the 400 MHz and 500 MHz versions, presents calculations for ambient and junction temperatures, and discusses heatsink and fan solutions, interface materials, and attachment methods. A vendor list with thermal‑solution suppliers is provided for reference.
| Maximum Junction Temperature | 100 °C |
|---|---|
| Package Type | PBGA 495 |
| Package Dimensions | 27.35 mm × 31.15 mm |
| Forward Bias Current (Thermal Diode) | 5 µA min / 500 µA typ |
The maximum device junction temperature must remain below 100 °C.
Yes, it incorporates an on‑die thermal diode that can be used to monitor die temperature.
A vendor list is provided in Table 9 on page 19, including companies such as Kurz Instruments, Omega Engineering, and Rogers Communications.