Fortimo SLM platform thermal design guide, including thermal characteristics, measurement methods, temperature requirements, cooling solutions, etc.
This guide provides thermal design information for the Philips Fortimo SLM platform. It includes thermal specifications, methods for measuring the critical temperature point, and recommendations for passive and active cooling solutions.
The document lists maximum and typical dissipated power, allowable ambient and case temperatures, and required thermal impedance for each SLM module variant. It also describes thermal interface materials (TIM) and practical measurement techniques for the critical temperature point.
| Max dissipated thermal power (SLM 800Im) | 10W |
|---|---|
| Maximum case temperature (Tcase) | 65 °C |
| Maximum ambient temperature | 35 °C |
Measure Tcase at the centre point at the bottom of the module, using a thin V‑groove or small drill hole in the heat sink to reach the module bottom.
Thermal pastes perform better than thermal pads.
Limiting the number of thermal interfaces from module to ambient is strongly recommended.