TINI PowerSoCs are highly integrated analog solutions that free up space on mobile platforms for new features. These SoCs integrate power, system, microcontroller and storage functions, and can power application and baseband processors. They also feature highly efficient power management functions to extend battery life and reduce heat.
The Maxim TINI SoC combines a microcontroller, memory, and extensive power‑management functions in a single chip. It integrates DC‑DC converters, LDOs, OVP, Smart Power, battery‑charging control, and various audio and sensor interfaces, enabling highly integrated, thin‑form‑factor designs.
The document lists the internal block diagram, supported interfaces (USB, HDMI, UART, SPI, SPMI, 1‑Wire, LVDS, RS‑232), and key specifications such as IC count, component count, and area. It also mentions the included microcontroller cores (MAXOW, 8051, ARM, DSP) and peripheral blocks for audio, video, and sensor processing. This manual is written in Chinese.
| Component count | 121 |
|---|---|
| IC area (mm²) | 321 |
| Power‑management functions | DC‑DC converters, LDO, OVP, Smart Power, battery‑charging management |
| Integrated microcontroller cores | MAXOW, 8051, ARM, DSP |
It includes DC‑DC converters, LDO regulators, over‑voltage protection (OVP) and Smart Power management, as well as battery‑charging control.
It contains MAXOW, 8051, ARM, and DSP cores.