Intersil ISL6265 Datasheet

ISL6265 is a multi-output controller with integrated MOSFET drivers from Intersil for AMD SVI capable mobile CPUs. The ISL6265 features a single phase controller that powers the Northbridge (VDDNB) portion of the CPU. The remaining two controller channels can be configured for two-phase or individual single-phase outputs. For uniplane CPU applications, the ISL6265 is configured as a two-phase buck converter. This allows the controller to interleave channels to effectively double the output voltage ripple frequency and thereby reduce output voltage ripple amplitude with fewer components, lower component cost, reduced power dissipation, and smaller area. For dual-plane processors, the ISL6265 can be configured as independent single-phase controllers powering VDD0 and VDD1. The heart of the ISL6265 is Intersil’s patented R3 Technology™, the Robust Ripple Regulator modulator. Compared with the traditional buck regulator, the R3 Technology™ has a faster transient response. This is due to the R3 modulator commanding variable switching frequency during a load transient. The Serial VID Interface (SVI) provides the means for the CPU to communicate with the ISL6265 via the I²C bus and thus receive input voltage, output voltage, and temperature information.


Intersil ISL6265 Datasheet - cover page
Brand
Intersil
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
24
File format
PDF
File size
578 KB
Published
28 March, 2012
Updated
30 September, 2023
Model
ISL6265
MD5 checksum
544F7B3E0201E1D99039C915F585DDE8

About this manual

The ISL6265 is a multi‑output controller with embedded gate drivers designed for AMD mobile CPUs. It can operate as a two‑phase buck converter for uniplane CPUs or as independent single‑phase controllers for dual‑plane processors, offering flexible voltage regulation and high efficiency.

The document includes functional block diagrams, application circuits, absolute maximum ratings, detailed electrical specifications, pin‑routing recommendations, and a package outline drawing, helping designers implement the device in power‑management solutions.

What's inside

  • Features
  • Absolute Maximum Ratings
  • Electrical Specifications
  • Offset Function
  • Logic Inputs
  • SVI Interface
  • Pin Routing Guidelines
  • Package Outline Drawing
  • Function Block Diagram
  • Application Circuits
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