Industrial Manuals

This document provides SOT349-2 PC board printing circuit diagram, including dimensions, coordinates, etc.

This document provides information on the PC board footprint and placement accuracy of Philips Semiconductors on February 19, 2001. It includes dimensions and accuracy information for several different package names.

This is a PDF file. The file contains the PCB footprint dimensions information of the SOT1024-2 product.

This is a PDF document that introduces the PC board footprint, solder land occupied area and PCB layout drawing of SOT765-1

The document provides detailed information about Philips Semiconductors PC board footprint SC-75; SC-89 FOOTPRINT (REFLOW SOLDERING).

This is a technical manual about SOT687-1 FOOTPRINT (REFLOW SOLDERING)

This document discusses factors that need consideration when an I2C-bus is used to communicate between two points that do not share a common logic ground potential. I2C logic signals are referenced to a ground level and it is expected that connected devices share that reference. In practice, when an I2C-bus is extended to link devices that are separated by distances exceeding about 1 meter there can be many factors that cause differences in the local ground potential of those devices and that in turn affects the noise margins of the system and can lead to device ratings being exceeded. In other cases, where an I2C-bus could provide an attractive data link there is no possibility for a shared ground reference. Examples include the need to provide safety isolation between the I2C control signals and AC mains power, telephone lines, or patient monitoring medical equipment. In other cases, such as Power over Ethernet, standards require isolation of the grounds. Solutions are provided to deal with ground differences ranging from less than 1 V up to kilovolt levels by using Opto or transformer isolators in the signal path. Key to all solutions is the availability of I2C isolation devices.

NXP Voltage Translators (NVT) are used in bidirectional signaling voltage level translation applications for I/O buses with incompatible logic levels. The NVT2001 and NVT2002 are single- and dual-channel voltage translators, operational from 1.0 V to 3.6 V at VCC(A) (low voltage side) and 1.8 V to 5.5 V at VCC(B) (high voltage side) without direction control for open-drain or push-pull I/O devices.

The OM11055 is a PCF8883 evaluation board which can be used to demonstrate and evaluate the PCF8883 capacitive proximity switch. The PCB is designed to make it easy to adjust the switch’s sensitivity. The board can be powered using a Mini USB cable or a 9V battery.

This document introduces the NXP CATV C-family products, including BGY588C, BGE788C, and CGY888C push-pull amplifiers, BGD712C, CGD944C, and CGD942C power doublers, and BGO807C optical receiver. These products are compliant with the Chinese State Administration for Radio, Film and Television (SARFT) standard and provide excellent linearity, stability, and reliability for cable TV networks in China.

NXP's payment solutions offer financial institutions, card manufacturers and consumers a variety of secure, reliable and attractive solutions.

MicroPak and MicroPak II packages are the world's smallest packages for single-, dual-, and triple-gate logic. They are 65% - 74% smaller than their PicoGate equivalents and offer a larger pad size that provides a more rugged and reliable bond between the device and the PC board.

The NXP ARM7 series microcontrollers integrate an LCD controller, with powerful performance and a wide range of applications in consumer, entertainment, industrial/commercial, medical and automotive applications.