The document provides information about the test conditions and maximum ratings of a product manufactured by IXYS in 2004, including voltage, current, power dissipation, and other parameters. The product features a silicon chip on a direct-copper-bond substrate, enabling high power dissipation and isolated mounting surface. Additionally, it offers high blocking capability, low on-resistance, and avalanche rating for unclamped inductive switching. With low thermal resistance and drain to tab capacitance, this product is suitable for applications such as switched mode power supplies, uninterruptible power supplies, power factor correction, welding, and inductive heating.